Invention Publication
- Patent Title: LASER MACHINING DEVICE AND LASER MACHINING METHOD
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Application No.: US17917060Application Date: 2021-02-17
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Publication No.: US20230143460A1Publication Date: 2023-05-11
- Inventor: Takashi KURITA , Yuu TAKIGUCHI
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Priority: JP 20070001 2020.04.08
- International Application: PCT/JP2021/005955 2021.02.17
- Date entered country: 2022-10-05
- Main IPC: G02B5/32
- IPC: G02B5/32 ; B23K26/06 ; B23K26/03 ; B23K26/067

Abstract:
A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit controls light intensities of at least two irradiation points included in the plurality of irradiation points independently of each other.
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