- 专利标题: ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT
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申请号: US17958635申请日: 2022-10-03
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公开(公告)号: US20230145507A1公开(公告)日: 2023-05-11
- 发明人: Osamu HASHIGUCHI
- 申请人: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- 申请人地址: JP Tokyo
- 专利权人: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- 当前专利权人: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP 21180925 2021.11.05
- 主分类号: H05K3/30
- IPC分类号: H05K3/30 ; H05K3/34 ; H05K3/12
摘要:
A connector includes lead parts and terminal parts to be connected to lands of a substrate, respectively. An anisotropic conductive joining member (ACJM) is mounted in a region where the lead parts are located. The ACJM is a resin in which solder particles are dispersed. The resin can melt at a temperature lower than the melting point of the solder particles. Cream solder is placed on the lands to be connected to the terminal parts. The substrate on which the connector is mounted is passed through a reflow oven to heat both the substrate and the connector. The connection between the terminal parts and the lands by reflow soldering and the connection between the lead parts and the lands via the ACJM 40 are performed simultaneously with each other.
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