Invention Publication
- Patent Title: RADIO-FREQUENCY MODULE
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Application No.: US18154225Application Date: 2023-01-13
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Publication No.: US20230145698A1Publication Date: 2023-05-11
- Inventor: Hiromichi KITAJIMA , Takanori UEJIMA , Kunitoshi HANAOKA , Motoji TSUDA
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Priority: JP 20136566 2020.08.13
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04B1/04

Abstract:
A radio-frequency module includes a power amplifier, a power amplifier, a low noise amplifier, a duplexer that has a passband including a communication band A included in a communication band group X and that is connected to the power amplifier and the low noise amplifier, a duplexer that has a passband including a communication band C included in a communication band group Y lower than the communication band group X and that is connected to the power amplifier, and a module substrate having the power amplifier, the power amplifier, the low noise amplifier, and the duplexers arranged thereon. In a plan view of the module substrate, a distance between the power amplifier and the low noise amplifier is longer than a distance between the power amplifier and the low noise amplifier.
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