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公开(公告)号：US20240105628A1
公开(公告)日：2024-03-28
申请号：US18496304
申请日：2023-10-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Naoya MATSUMOTO
IPC: H01L23/538 , H01L23/31 , H01L23/498 , H01L23/552 , H01L25/16
CPC classification number: H01L23/5383 , H01L23/3121 , H01L23/49811 , H01L23/5385 , H01L23/5386 , H01L23/552 , H01L25/16 , H01L24/16 , H01L2224/16225
Abstract: A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a connection terminal, and a wiring layer. The second electronic component is disposed on the second main surface of the mounting substrate. The connection terminal is disposed on the second main surface of the mounting substrate and is connected to the mounting substrate and the wiring layer. The wiring layer faces the second main surface of the mounting substrate with the second electronic component interposed therebetween and is in contact with the connection terminal. The wiring layer has a base material and an external connection electrode. The base material has a second conductive member connected to the first conductive member of the mounting substrate with the connection terminal interposed therebetween. The external connection electrode is connected to the second conductive member. The wiring layer is in contact with the second electronic component.
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公开(公告)号：US20240072838A1
公开(公告)日：2024-02-29
申请号：US18489044
申请日：2023-10-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Dai NAKAGAWA , Takanori UEJIMA
CPC classification number: H04B1/44 , H04B1/0078
Abstract: A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface opposite to each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disposed on the first principal surface of the mounting board, and covers at least a part of an outer peripheral surface of the first electronic component. The first ground electrode covers at least a part of the first resin layer. A principal surface of the first electronic component opposite to the mounting board is in contact with the first ground electrode. The mounting board includes a second ground electrode inside the mounting board. The first ground electrode is not in contact with the second ground electrode.
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公开(公告)号：US20240038692A1
公开(公告)日：2024-02-01
申请号：US18477589
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takashi YAMADA , Kiyoshi AIKAWA , Hiromichi KITAJIMA , Takanori UEJIMA , Yoshihiro DAIMON
IPC: H01L23/66 , H01L23/498 , H03F3/24 , H03F1/56 , H01L25/065
CPC classification number: H01L23/66 , H01L23/49822 , H01L23/49838 , H03F3/245 , H03F1/565 , H01L25/0652 , H01L2223/6655 , H01L2223/6677 , H01L2223/6616 , H03F2200/294 , H03F2200/451 , H01L2223/6672
Abstract: A high-frequency module includes a first module substrate including first and second major surfaces, and a second module substrate including third and fourth major surfaces. The first major surface (faces the second major surface. Electronic components are disposed between the second and third major surfaces, on the first major surface, and on the fourth major surface. External connection terminals are disposed on the fourth major surface. A recess is formed in the first major surface. The electronic components include a first electronic component and a second electronic component (shorter in height than the first electronic component. The first electronic component is disposed in the recess, and the second electronic component is disposed in a region outside of the recess on the first major surface.
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公开(公告)号：US20240023263A1
公开(公告)日：2024-01-18
申请号：US18473289
申请日：2023-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihiro DAIMON , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Takashi YAMADA , Takanori UEJIMA
CPC classification number: H05K7/026 , H05K1/181 , H05K1/144 , H05K1/0237 , H03F3/245
Abstract: A high-frequency module includes a module substrate having major surfaces, and a module substrate having major surfaces. The major surface are disposed facing the major surface. A first electronic component includes a filter coupled to a power amplifier and a low-noise amplifier. A second electronic component includes a filter coupled to a low-noise amplifier. A third electronic component includes a switch coupled between filters and an antenna connection terminal. The first electronic component is disposed between the major surfaces, on the major surface, or on the major surface. The second electronic component is disposed between the major surfaces, on the major surface, or on the major surface where the first electronic component is not disposed. The third electronic component is disposed between the major surfaces, on the major surface, or on the major surface wherein neither of the first nor second electronic component is disposed.
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公开(公告)号：US20240014841A1
公开(公告)日：2024-01-11
申请号：US18473329
申请日：2023-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Kiyoshi AIKAWA , Takashi YAMADA , Yoshihiro DAIMON
Abstract: A radio-frequency module includes one or more first electronic components disposed on one main surface and one or more second electronic components disposed on another main surface. The one or more first electronic components include at least one of a filter whose passband includes a first band, a switch connected to the filter, a power amplifier connected to the filter, and a switch connected to the filter. The one or more second electronic components include at least one of a filter whose passband includes a second band in which the frequency of a harmonic wave of a signal in the first band is included, a switch connected to the filter, a low-noise amplifier connected to the filter, and an inductor connected to a path that forms a connection between the first low-noise amplifier and an antenna connection terminal.
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Patent Agency Ranking
公开(公告)号：US20230200032A1
公开(公告)日：2023-06-22
申请号：US18166551
申请日：2023-02-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shota HAYASHI , Nobuaki OGAWA , Yuki ASANO , Takanori UEJIMA , Hiromichi KITAJIMA , Takahiro EGUCHI
IPC: H05K9/00 , H01L25/065 , H01L25/16 , H01L23/552 , H01L21/56 , H05K3/28 , H05K1/18
CPC classification number: H05K9/0022 , H01L21/56 , H01L23/552 , H01L25/165 , H01L25/0655 , H05K1/181 , H05K3/284 , H05K9/0039 , H05K2201/1003 , H05K2201/10015 , H05K2201/10022 , H05K2201/10371 , H05K2203/025 , H05K2203/1316
Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The metal member further includes one or more foot portions extending forward or backward from the lower side.
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公开(公告)号：US20230198478A1
公开(公告)日：2023-06-22
申请号：US18167225
申请日：2023-02-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Rui TANAKA
CPC classification number: H03F3/195 , H03F1/565 , H03F3/68 , H03F3/245 , H04B1/40 , H03F2200/111 , H03F2200/165 , H03F2200/171 , H03F2200/294 , H03F2200/451
Abstract: A radio-frequency module includes a first inductor and a second inductor disposed on or above a major surface of a module substrate, a resin member, a metal shield layer covering a surface of the resin member, and a metal shield plate disposed on the major surface between the first inductor and the second inductor. The metal shield plate is in contact with a ground electrode of the major surface and the metal shield layer. The first inductor is disposed in any one of a transmitting path, a receiving path, and a transmitting and receiving path. The second inductor is disposed in any one of the transmitting path, the receiving path, and the transmitting and receiving path, other than the path in which the first inductor is disposed.
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公开(公告)号：US20230187388A1
公开(公告)日：2023-06-15
申请号：US18166563
申请日：2023-02-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shota HAYASHI , Nobuaki OGAWA , Yuki ASANO , Takanori UEJIMA , Hiromichi KITAJIMA , Takahiro EGUCHI
IPC: H01L23/66
CPC classification number: H01L23/66 , H01L2223/6661
Abstract: A substrate has an upper main surface and a lower main surface arranged in an up-down direction. The metal member is provided on the upper main surface of the substrate. The metal member includes a plate-shaped portion and one or more foot portions. The plate-shaped portion has a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction. The one or more foot portions extend backward from the lower side by bending the metal member at the lower side of the plate-shaped portion. A line extending in a predetermined direction is provided on the front main surface, the back main surface, the outer surface of the portion where the metal member is bent, and the inner surface of the portion where the metal member is bent.
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公开(公告)号：US20210203365A1
公开(公告)日：2021-07-01
申请号：US17123109
申请日：2020-12-16
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Hiromichi KITAJIMA
Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier disposed on the module board; a low noise amplifier disposed on the module board; a transmission filter (a first acoustic wave filter) disposed on one of the first principal surface and the second principal surface; and a reception filter (a second acoustic wave filter) disposed on one of the first principal surface and the second principal surface. An absolute value of a temperature coefficient of frequency (TCF) of the transmission filter is smaller than an absolute value of a TCF of the reception filter, and a distance between the transmission filter and the power amplifier is shorter than a distance between the reception filter and the power amplifier.
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公开(公告)号：US20240047377A1
公开(公告)日：2024-02-08
申请号：US18492051
申请日：2023-10-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Hiromichi KITAJIMA , Dai NAKAGAWA
IPC: H01L23/552 , H01L25/16
CPC classification number: H01L23/552 , H01L25/16
Abstract: A high-frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a metal electrode layer. The first electronic component and the second electronic component are disposed on a first main surface of the mounting substrate. The metal electrode layer covers at least a part of the resin layer, and overlaps with at least a part of the first electronic component and at least a part of the second electronic component in a plan view. At least a part of a main surface of the first electronic component opposite to the mounting substrate side is in contact with the metal electrode layer. The metal electrode layer has a through-portion between a first signal terminal of the first electronic component and a second signal terminal of the second electronic component in the plan view.
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