Invention Publication
- Patent Title: ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY
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Application No.: US17755193Application Date: 2020-10-20
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Publication No.: US20230146579A1Publication Date: 2023-05-11
- Inventor: Ranjit PANDHER , Niveditha NAGARAJAN , Girard SIDONE , Carl BILGRIEN
- Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
- Applicant Address: US CT Waterbury
- Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
- Current Assignee: ALPHA ASSEMBLY SOLUTIONS INC.
- Current Assignee Address: US CT Waterbury
- International Application: PCT/EP2020/025466 2020.10.20
- Date entered country: 2022-09-16
- Main IPC: B23K35/30
- IPC: B23K35/30 ; H01L23/00 ; B23K1/00 ; B23K35/40
Abstract:
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
Information query
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