公开(公告)号：US20240198460A1

公开(公告)日：2024-06-20

申请号：US18555829

申请日：2022-04-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Girard SIDONE ,  Carl BILGRIEN

IPC: B23K35/02 ,  B23K1/19 ,  B23K35/26 ,  B23K35/30

CPC classification number: B23K35/0238 ,  B23K1/19 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3093

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

公开(公告)号：US20230146579A1

公开(公告)日：2023-05-11

申请号：US17755193

申请日：2020-10-20

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Girard SIDONE ,  Carl BILGRIEN

IPC: B23K35/30 ,  H01L23/00 ,  B23K1/00 ,  B23K35/40

CPC classification number: B23K35/302 ,  H01L24/29 ,  B23K1/0016 ,  B23K35/404 ,  B23K2101/40

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

公开(公告)号：US20240021565A1

公开(公告)日：2024-01-18

申请号：US18370150

申请日：2023-09-19

Applicant: Alpha Assembly Solutions Inc.

Inventor： Angelo GULINO ,  Bogdan BANKIEWICZ ,  Oscar KHASELEV ,  Anna LIFTON ,  Michael T. MARCZI ,  Girard SIDONE ,  Paul SALERNO ,  Paul J. KOEP

IPC: H01L23/00

CPC classification number: H01L24/29 ,  H01L24/27 ,  H01L2224/29111 ,  H01L2224/29411 ,  H01L2224/29347 ,  H01L2224/29013 ,  H01L2924/20755 ,  H01L2224/27849 ,  H01L2924/351 ,  H01L2924/014

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.