Invention Publication
- Patent Title: STEREOISOMER OF EPOXY COMPOUND, CURABLE COMPOSITION CONTAINING THE SAME, AND CURED PRODUCT OBTAINED BY CURING CURABLE COMPOSITION
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Application No.: US17906829Application Date: 2021-03-25
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Publication No.: US20230151138A1Publication Date: 2023-05-18
- Inventor: Shohei TAKATA , Takeshi KOIKE , Kenta UE
- Applicant: ENEOS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ENEOS CORPORATION
- Current Assignee: ENEOS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 20058925 2020.03.27
- International Application: PCT/JP2021/012523 2021.03.25
- Date entered country: 2022-09-20
- Main IPC: C08G59/18
- IPC: C08G59/18 ; C08G59/02 ; C07D493/08
Abstract:
Provided are a stereoisomer of an epoxy compound that when contained in a curable composition, can improve the heat resistance and dielectric properties of the cured product of the curable composition, a curable composition containing the stereoisomer, and a cured product of the curable composition. A stereoisomer of an epoxy compound represented by Formula (1) below, the stereoisomer being represented by Formula (2), and a curable composition containing the stereoisomer are used:
in which in Formula (1), R1 to R18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; and
in which in Formula (2), R1 to R18 are each the same as in Formula (1).
in which in Formula (1), R1 to R18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; and
in which in Formula (2), R1 to R18 are each the same as in Formula (1).
Information query
