公开(公告)号：US20230151138A1

公开(公告)日：2023-05-18

申请号：US17906829

申请日：2021-03-25

Applicant: ENEOS CORPORATION

Inventor： Shohei TAKATA ,  Takeshi KOIKE ,  Kenta UE

IPC: C08G59/18 ,  C08G59/02 ,  C07D493/08

CPC classification number: C08G59/18 ,  C08G59/02 ,  C07D493/08 ,  C07B2200/07

Abstract: Provided are a stereoisomer of an epoxy compound that when contained in a curable composition, can improve the heat resistance and dielectric properties of the cured product of the curable composition, a curable composition containing the stereoisomer, and a cured product of the curable composition. A stereoisomer of an epoxy compound represented by Formula (1) below, the stereoisomer being represented by Formula (2), and a curable composition containing the stereoisomer are used:




in which in Formula (1), R1 to R18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; and




in which in Formula (2), R1 to R18 are each the same as in Formula (1).

公开(公告)号：US20210340118A1

公开(公告)日：2021-11-04

申请号：US17274123

申请日：2019-08-19

Applicant: ENEOS CORPORATION

Inventor： Shohei TAKATA ,  Kenta UE ,  Takeshi KOIKE ,  Atsushi KAMEYAMA

IPC: C07D301/12 ,  C07D493/04 ,  C07D407/04 ,  B01J23/30 ,  B01J31/02 ,  B01J27/055

Abstract: The invention provides a method for producing an epoxy compound by hydrogen peroxide using an organic compound having a carbon-carbon double bond as a raw material, wherein a by-product is suppressed from being generated and the epoxy compound is produced in a high yield. In particular, the invention provides a method for producing an epoxy compound involving oxidizing a carbon-carbon double bond in an organic compound with hydrogen peroxide in the presence of a catalyst, wherein the catalyst comprises a tungsten compound; a phosphoric acid, a phosphonic acid or salts thereof; and an onium salt having an alkyl sulfate ion represented by formula (I) as an anion: wherein R1 is a linear or branched aliphatic hydrocarbon group having 1 to 18 carbons, which may be substituted with 1 to 3 phenyl groups.

公开(公告)号：US20210206916A1

公开(公告)日：2021-07-08

申请号：US17178474

申请日：2021-02-18

Applicant: ENEOS CORPORATION

Inventor： Atsushi KAMEYAMA ,  Ryuichi UENO ,  Hisashi SONE ,  Shohei TAKATA ,  Takashi SEKI

IPC: C08G65/26

Abstract: The present invention discloses a curable composition comprising: an epoxy compound represented by the following Formula (1); and one selected from the group consisting of: a thermal cationic polymerization initiator, an acid anhydride-based curing agent and a curing accelerator, and a photo-cationic polymerization initiator as well as the cured product therefrom. The above described curable composition is useful in that it allows for the production of a cured product having a high heat resistance. (In the Formula (1), A represents CR17R18; B represents CR19R20; R1 to R20 each independently represents a substituent selected from the group consisting of a hydrogen atom, an alkyl group and an alkoxy group; and n represents 0 or 1, with the proviso that when n is 0, m represents 1, and when n is 1, m represents 0.)