Invention Publication
- Patent Title: BONDING METHOD FOR REPAIR OF SUPERALLOY ARTICLE
-
Application No.: US17842926Application Date: 2022-06-17
-
Publication No.: US20230151736A1Publication Date: 2023-05-18
- Inventor: Brian T. Hazel , John R. Farris , Matthew A. Devore , John A. Sharon , James F. Wiedenhoefer , Paul M. Lutjen , Mario P. Bochiechio
- Applicant: Raytheon Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: Raytheon Technologies Corporation
- Current Assignee: Raytheon Technologies Corporation
- Current Assignee Address: US CT Farmington
- Main IPC: F01D5/00
- IPC: F01D5/00 ; B22F3/105 ; B22F3/24
Abstract:
A method of repair of a part is provided and includes removing a section that is damaged from the part, casting a replacement section for the part, the replacement section having a geometry similar to that of the section in an undamaged condition and bonding the replacement section to the part using field assisted sintering technology (FAST).
Information query
