Invention Publication
- Patent Title: HAPTIC FEEDBACK BASE PLATE, HAPTIC FEEDBACK APPARATUS AND HAPTIC FEEDBACK METHOD
-
Application No.: US17620538Application Date: 2021-02-26
-
Publication No.: US20230152892A1Publication Date: 2023-05-18
- Inventor: Hui HUA , Yuju CHEN , Xiaofeng YIN
- Applicant: Beijing BOE Technology Development Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Technology Development Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Beijing BOE Technology Development Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- International Application: PCT/CN2021/078073 2021.02.26
- Date entered country: 2021-12-17
- Main IPC: G06F3/01
- IPC: G06F3/01 ; B06B1/06

Abstract:
The present disclosure provides a haptic feedback base plate, a haptic feedback apparatus and a haptic feedback method. The haptic feedback base plate comprises: a substrate and a deformation unit disposed on one side of the substrate. The deformation unit comprises a first electrode, a piezoelectric material layer and a second electrode that are arranged in a stacked manner, the first electrode is arranged close to the substrate, the first electrode and the second electrode are configured to form an alternating electric field, and the piezoelectric material layer vibrates under the effect of the alternating electric field and drives the substrate to resonate, wherein a difference between a frequency of the alternating electric field and an inherent frequency of the substrate is less than or equal to a preset threshold.
Public/Granted literature
- US11847263B2 Haptic feedback base plate, haptic feedback apparatus and haptic feedback method Public/Granted day:2023-12-19
Information query