Invention Application
- Patent Title: WIRING CIRCUIT BOARD
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Application No.: US17783537Application Date: 2020-12-15
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Publication No.: US20230015337A1Publication Date: 2023-01-19
- Inventor: Rihito FUKUSHIMA , Shusaku SHIBATA , Teppei NIINO
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2019-228698 20191218
- International Application: PCT/JP2020/046742 WO 20201215
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/32 ; H05K1/09 ; H05K1/05

Abstract:
A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.
Public/Granted literature
- US12137522B2 Wiring circuit board Public/Granted day:2024-11-05
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