公开(公告)号：US20240292528A1

公开(公告)日：2024-08-29

申请号：US18444079

申请日：2024-02-16

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Takaya KOUCHI ,  Teppei NIINO

IPC: H05K1/02

CPC classification number: H05K1/0296

Abstract: A wiring circuit board includes a base insulating layer, a conductive layer, and a cover insulating layer. The conductive layer has a terminal and a wiring. The wiring has a body portion and a connecting portion. The connecting portion connects the body portion to the terminal. The cover insulating layer has a cover body portion and a protruding portion. The cover body portion covers the body portion. The protruding portion covers the connecting portion. The protruding portion protrudes from the cover body portion.

公开(公告)号：US20240023237A1

公开(公告)日：2024-01-18

申请号：US18253894

申请日：2021-10-26

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Shusaku SHIBATA ,  Teppei NIINO

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0281 ,  H05K1/189 ,  H05K2201/09727 ,  H05K2201/0191

Abstract: A wiring circuit board includes a first insulating layer and a conductive pattern. The conductive pattern has a first terminal, and a wiring connected to the first terminal. The wiring has a first portion disposed away from the first terminal, and a second portion disposed between the first terminal and the first portion. The first portion of the wiring and the first terminal include a portion consisting of the first conductive layer and the second conductive layer. The second portion of the wiring consists of the first conductive layer.

公开(公告)号：US20240015884A1

公开(公告)日：2024-01-11

申请号：US18252308

申请日：2021-10-28

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Takahiro IKEDA ,  Teppei NIINO

IPC: H05K1/02 ,  H05K3/42 ,  H05K3/40 ,  H05K1/09

CPC classification number: H05K1/0298 ,  H05K3/429 ,  H05K3/4076 ,  H05K1/092 ,  H05K2201/0338

Abstract: Provided is a wiring circuit board that includes a metal supporting board; a first metal thin film; an insulating layer; a second metal thin film; and a conductive layer in order toward one side in a thickness direction. The metal supporting board includes a metal supporting layer and a surface metal layer. The surface metal layer is disposed on one surface in the thickness direction of the metal supporting layer and has higher conductivity than the metal supporting layer. The insulating layer has a through hole. The conductive layer has a via portion. The via portion is disposed in the through hole and is electrically connected to the metal supporting board.

公开(公告)号：US20210204398A1

公开(公告)日：2021-07-01

申请号：US16755733

申请日：2018-10-12

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Takahiro TAKANO ,  Hiromoto HARUTA ,  Shuichi WAKAKI

IPC: H05K1/02

Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 μm or less.

公开(公告)号：US20230098947A1

公开(公告)日：2023-03-30

申请号：US17908470

申请日：2021-02-24

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Hiroaki MACHITANI ,  Teppei NIINO

IPC: H05K1/11 ,  H05K1/05 ,  H05K3/32 ,  H05K1/02 ,  H05K3/46

Abstract: A wiring circuit board includes two insulating layers, a wiring layer, a pad portion, and a conductive connection portion. The wiring layer is on one side in a thickness direction of the first insulating layer, and has a contact portion. The second insulating layer is on one side in the thickness direction of the first insulating layer to cover the wiring layer. The pad portion is on one side in the thickness direction of the second insulating layer. The second insulating layer has a through opening portion and having an opening along at least a part of a peripheral end portion of the pad portion. The contact portion of the wiring layer faces the through opening portion. The conductive connection portion, is connected to at least the peripheral end portion of the pad portion, and the contact portion, and electrically connects the wiring layer to the pad portion.

公开(公告)号：US20210243900A1

公开(公告)日：2021-08-05

申请号：US17237616

申请日：2021-04-22

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Takahiro TAKANO ,  Hayato TAKAKURA ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K3/10 ,  H05K1/02

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0

公开(公告)号：US20200288575A1

公开(公告)日：2020-09-10

申请号：US16649825

申请日：2018-09-06

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Hayato TAKAKURA ,  Masaki ITO ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46

Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

公开(公告)号：US20170189895A1

公开(公告)日：2017-07-06

申请号：US15466279

申请日：2017-03-22

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshiharu HATAKEYAMA ,  Takahiro FUKUOKA ,  Junichi NAGASE ,  Shusaku SHIBATA ,  Tatsuki NAGATSUKA ,  Saori FUKUZAKI

IPC: B01J31/38 ,  B01J31/06 ,  C07F7/28 ,  B01J31/22 ,  C07F3/00 ,  B01J31/26 ,  C08K9/04

CPC classification number: B01J31/38 ,  B01J31/06 ,  B01J31/2208 ,  B01J31/2221 ,  B01J31/26 ,  B01J31/28 ,  B01J2231/005 ,  B01J2531/46 ,  B01J2531/66 ,  C01F11/183 ,  C07F3/00 ,  C07F3/003 ,  C07F5/00 ,  C07F5/003 ,  C07F7/28 ,  C07F19/00 ,  C08K9/04

Abstract: Organic-inorganic composite particles that can be dispersed in a solvent and/or a resin as primary particles having an organic group on the surface of inorganic particles, the organic-inorganic composite particles having negative birefringence.

公开(公告)号：US20230147342A1

公开(公告)日：2023-05-11

申请号：US18054029

申请日：2022-11-09

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Teppei NIINO ,  Yosuke NAKANISHI

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/24 ,  H05K3/28 ,  H05K1/05

CPC classification number: H05K1/0296 ,  H05K1/09 ,  H05K3/24 ,  H05K3/28 ,  H05K1/05

Abstract: Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.

公开(公告)号：US20230015337A1

公开(公告)日：2023-01-19

申请号：US17783537

申请日：2020-12-15

Applicant: NITTO DENKO CORPORATION

Inventor： Rihito FUKUSHIMA ,  Shusaku SHIBATA ,  Teppei NIINO

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/09 ,  H05K1/05

Abstract: A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.