Invention Publication
- Patent Title: CHIP TRANSFER APPARATUS
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Application No.: US17736352Application Date: 2022-05-04
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Publication No.: US20230154769A1Publication Date: 2023-05-18
- Inventor: Dongkyun KIM , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG , Kyungwook HWANG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20210158049 2021.11.16
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/673 ; B65G51/02

Abstract:
A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.
Public/Granted literature
- US12068178B2 Chip transfer apparatus Public/Granted day:2024-08-20
Information query
IPC分类: