Invention Publication
- Patent Title: ELECTROSTATIC CHUCK AND PROCESSING APPARATUS
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Application No.: US17642083Application Date: 2020-12-24
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Publication No.: US20230154780A1Publication Date: 2023-05-18
- Inventor: Takeshi TAKABATAKE , Tomohiro NAKASUJI , Akira ITOH , Kentaro SETO , Yutaka OMOTO , Hiroho KITADA , Kazuumi TANAKA
- Applicant: TOCALO Co., Ltd. , HITACHI HIGH-TECH CORPORATION
- Applicant Address: JP Kobe-shi, Hyogo
- Assignee: TOCALO Co., Ltd.,HITACHI HIGH-TECH CORPORATION
- Current Assignee: TOCALO Co., Ltd.,HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Kobe-shi, Hyogo; JP Minato-ku, Tokyo
- International Application: PCT/JP2020/048578 2020.12.24
- Date entered country: 2022-03-10
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687 ; H01J37/32

Abstract:
A Johnsen-Rahbek force type electrostatic chuck including: a metal substrate; an electrode for electrostatic attraction provided on the metal substrate with an insulating layer interposed between the metal substrate and the electrode for electrostatic attraction; and a dielectric layer constituting an electrostatic attraction surface in contact with a workpiece. The dielectric layer includes a ceramic spray coating and a sealing component with which pores of the ceramic spray coating are filled, and the sealing component contains a metal organic salt containing a rare earth element.
Public/Granted literature
- US11955360B2 Electrostatic chuck and processing apparatus Public/Granted day:2024-04-09
Information query
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