Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE
-
Application No.: US17717674Application Date: 2022-04-11
-
Publication No.: US20230154879A1Publication Date: 2023-05-18
- Inventor: Si Yun KIM , Kang Hun KIM , Jun Yong SONG
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si Gyeonggi-do
- Priority: KR 20210157869 2021.11.16
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A semiconductor device is provided. The semiconductor device includes a substrate, input and output (I/O) pads disposed at an upper portion of the semiconductor substrate, and first bump pillars disposed over the I/O pads. The first bump pillars are selectively arranged over some of the I/O pads in a first horizontal direction.
Information query
IPC分类:
