Invention Publication
- Patent Title: FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE
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Application No.: US18158748Application Date: 2023-01-24
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Publication No.: US20230167258A1Publication Date: 2023-06-01
- Inventor: Kenji ISHII , Masato TOKUDA
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka-shi
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka-Shi
- Priority: JP 20132039 2020.08.03
- Main IPC: C08J9/06
- IPC: C08J9/06 ; H01B3/44 ; H01B7/02 ; H01B13/06

Abstract:
A foam molding composition containing a fluororesin (A) and a compound (B) having a pyrolysis temperature of 300° C. or higher and a solubility parameter (SP value) of 8 to 15. Also disclosed is a foamed electric wire including a core wire, and a fluororesin layer or a fluororesin composition layer covering the core wire, a foam molded body, a method for producing a foam molded body, and a method for producing an electric wire.
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