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公开(公告)号：US20230183450A1
公开(公告)日：2023-06-15
申请号：US18163498
申请日：2023-02-02
Applicant: DAIKIN INDUSTRIES, LTD.
Inventor： Hideki KOUNO , Kenji ISHII , Masato TOKUDA , Takahiro KITAHARA
IPC: C08K5/521 , C08L81/04 , C08L61/18 , C08J9/12 , C09D181/04 , C09D161/18 , B32B15/04 , B32B5/18 , H01B7/02 , H01B3/30 , H01B13/06
CPC classification number: C08K5/521 , C08L81/04 , C08L61/18 , C08J9/122 , C09D181/04 , C09D161/18 , B32B15/046 , B32B5/18 , H01B7/02 , H01B3/307 , H01B13/06 , C08J2381/04 , C08J2361/18 , C08J2481/04 , C08J2461/18 , B32B15/20
Abstract: A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.
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公开(公告)号：US20230167258A1
公开(公告)日：2023-06-01
申请号：US18158748
申请日：2023-01-24
Applicant: DAIKIN INDUSTRIES, LTD.
Inventor： Kenji ISHII , Masato TOKUDA
CPC classification number: C08J9/06 , H01B3/44 , H01B7/02 , H01B13/06 , C08J2327/18 , C08J2327/24 , C08J2203/00 , C08J2207/06
Abstract: A foam molding composition containing a fluororesin (A) and a compound (B) having a pyrolysis temperature of 300° C. or higher and a solubility parameter (SP value) of 8 to 15. Also disclosed is a foamed electric wire including a core wire, and a fluororesin layer or a fluororesin composition layer covering the core wire, a foam molded body, a method for producing a foam molded body, and a method for producing an electric wire.
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