Invention Publication
- Patent Title: MONITORING OF DEPOSITED OR ETCHED FILM THICKNESS USING IMAGE-BASED MASS DISTRIBUTION METROLOGY
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Application No.: US18070114Application Date: 2022-11-28
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Publication No.: US20230169643A1Publication Date: 2023-06-01
- Inventor: Mehdi Vaez-Iravani , Todd J. Egan
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G01B21/08 ; B25J9/16 ; G06T7/60

Abstract:
Implementations disclosed describe a method of obtaining a first image of a sample using a first light, wherein the sample has been subjected to a processing operation associated with a change of a thickness of the sample. The method further includes weighing the sample to obtain a first mass of the sample. The method further includes determining, based at least in part on the first image of the sample and the first mass of the sample, one or more properties of the sample, such as the change of a thickness of the sample, a change of an refractive index of the sample, and/or a change of an optical density of the sample a distribution of the change of the thickness of the sample.
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