There is provided a molding apparatus that molds a composition on a substrate by using a mold, characterized by including a control unit configured to control a process of forming a film of the composition between a first surface of the mold and the substrate by bringing the first surface into contact with the composition, and a deforming unit configured to deform the first surface into a convex shape with respect to a substrate side by applying power to a second surface of the mold on an opposite side to the first surface, wherein the control unit controls the deforming unit in the process so as to make power applied to the second surface by the deforming unit after contact between the first surface and the composition larger than power applied to the second surface by the deforming unit before the contact between the first surface and the composition.