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公开(公告)号：US20230173742A1
公开(公告)日：2023-06-08
申请号：US18162567
申请日：2023-01-31
发明人： YOSHIHIRO SHIODE
IPC分类号： B29C59/02
CPC分类号： B29C59/022 , B29C59/026 , B29C2037/903
摘要： There is provided a molding apparatus that molds a composition on a substrate by using a mold, characterized by including a control unit configured to control a process of forming a film of the composition between a first surface of the mold and the substrate by bringing the first surface into contact with the composition, and a deforming unit configured to deform the first surface into a convex shape with respect to a substrate side by applying power to a second surface of the mold on an opposite side to the first surface, wherein the control unit controls the deforming unit in the process so as to make power applied to the second surface by the deforming unit after contact between the first surface and the composition larger than power applied to the second surface by the deforming unit before the contact between the first surface and the composition.
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公开(公告)号：US20240262021A1
公开(公告)日：2024-08-08
申请号：US18423426
申请日：2024-01-26
发明人： YOSHIHIRO SHIODE
CPC分类号： B29C43/58 , B29C43/44 , B29C2043/5891
摘要： A measurement method of measuring deflection of a mold by measuring Newton's rings obtained by pressing the mold on a substrate with a resist interposed therebetween and irradiating the substrate with light via the mold includes: performing the pressing through the resist having a height less than an optical distance λ/4, λ being a wavelength of the light; measuring peak positions of the Newton's rings in a contact boundary portion between the mold and the substrate in a region in which a gap between the mold and the substrate is less than the optical distance λ/4; and calculating the deflection of the mold based on the peak positions.
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公开(公告)号：US20240219871A1
公开(公告)日：2024-07-04
申请号：US18603316
申请日：2024-03-13
发明人： YOSHIHIRO SHIODE
IPC分类号： G05B13/02 , G03F7/00 , G03F7/16 , G05B19/418
CPC分类号： G05B13/0265 , G03F7/0002 , G03F7/162 , G05B19/41885
摘要： An analysis method of analyzing a process for manufacturing a semiconductor device, includes a preparing step of preparing a plurality of data sets each including an input to a simulator that simulates the process and an output from the simulator, a generating step of generating, based on the plurality of data sets, a plurality of learning data having, as a value of an explanatory variable, a value of information, of process information associated with at least one of control and a state of the process, to which attention is to be paid and a value of evaluation information for evaluating the process as a valued of an objective variable, and a learning step of generating a model expressing the process by performing learning based on the plurality of learning data generated in the generating step.
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