Invention Publication
- Patent Title: SINTERED MATERIAL, SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SINTERED MATERIAL
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Application No.: US18076062Application Date: 2022-12-06
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Publication No.: US20230174429A1Publication Date: 2023-06-08
- Inventor: Changhwan KIM , Takafumi Noguchi , Toshihiro IIzuka , Younseon Wang , Kenichi Nagayama
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: JP 21199298 2021.12.08
- Main IPC: C04B35/553
- IPC: C04B35/553 ; C04B35/645

Abstract:
Provided are a sintered material having high corrosion resistance, a method of manufacturing the sintered material, a member for a semiconductor manufacturing apparatus, a method of manufacturing a member for a semiconductor manufacturing apparatus, a semiconductor manufacturing apparatus, and a method of manufacturing a semiconductor manufacturing apparatus. The sintered material according to an embodiment includes 50 mass% or more of yttrium oxyfluoride, has a relative density of 97.0% or more, and has a Vickers hardness of 5.0 GPa or more. The method of manufacturing a sintered material according to an embodiment includes forming a molded body including yttrium oxyfluoride powder having a particle size of 0.3 µm or less, and sintering the molded body under an atmospheric pressure at a temperature of 800° C. or less.
Public/Granted literature
- US3145392A Method of making collars for shirts Public/Granted day:1964-08-25
Information query
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