Invention Publication
- Patent Title: HOUSING STRUCTURE, PRODUCTION METHOD THEREOF, AND ELECTRONIC DEVICE
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Application No.: US18163798Application Date: 2023-02-02
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Publication No.: US20230176616A1Publication Date: 2023-06-08
- Inventor: Zhiyu Cao , Ming Cai , Huiting Zhong
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN SHENZHEN
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN SHENZHEN
- Priority: CN 2010780225.9 2020.08.05
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
This application provides a housing structure, a production method thereof, and an electronic device. The housing structure includes an appearance effect layer, a metal layer, a connection layer, and a non-metal layer that are laminated. The connection layer is configured to bind the metal layer and the non-metal layer. The appearance effect layer is formed after surface processing is performed on the metal layer. The housing structure includes both the metal layer and the non-metal layer. The metal layer and the non-metal layer are bound by using the connection layer, so that the housing structure has advantages of a metal layer housing and a non-metal layer housing. In addition, the appearance effect layer formed after surface processing is performed on the metal layer can ensure that the housing structure has a metallic appearance with an aesthetic appeal.
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