公开(公告)号：US20230176616A1

公开(公告)日：2023-06-08

申请号：US18163798

申请日：2023-02-02

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhiyu Cao ,  Ming Cai ,  Huiting Zhong

IPC: G06F1/16

CPC classification number: G06F1/1626 ,  G06F1/1656

Abstract: This application provides a housing structure, a production method thereof, and an electronic device. The housing structure includes an appearance effect layer, a metal layer, a connection layer, and a non-metal layer that are laminated. The connection layer is configured to bind the metal layer and the non-metal layer. The appearance effect layer is formed after surface processing is performed on the metal layer. The housing structure includes both the metal layer and the non-metal layer. The metal layer and the non-metal layer are bound by using the connection layer, so that the housing structure has advantages of a metal layer housing and a non-metal layer housing. In addition, the appearance effect layer formed after surface processing is performed on the metal layer can ensure that the housing structure has a metallic appearance with an aesthetic appeal.