Invention Publication
- Patent Title: FLOATING PCB DESIGN FOR SUBSTRATE SUPPORT ASSEMBLY
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Application No.: US17920111Application Date: 2021-04-06
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Publication No.: US20230178407A1Publication Date: 2023-06-08
- Inventor: Siyuan TIAN , Yuma OHKURA
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- International Application: PCT/US2021/025848 2021.04.06
- Date entered country: 2022-10-20
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01J37/32
Abstract:
A substrate support assembly includes a baseplate to support at least one layer to be disposed thereon and a first printed circuit board coupled to the baseplate by a plurality of mounting assemblies that allow the baseplate to move relative to the first printed circuit board.
Information query
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