公开(公告)号：US20220068691A1

公开(公告)日：2022-03-03

申请号：US17298984

申请日：2019-12-04

Applicant: LAM RESEARCH CORPORATION

Inventor： Siyuan TIAN

IPC: H01L21/683 ,  H01L23/00 ,  H01J37/32

Abstract: A substrate support for a plasma chamber includes a base plate arranged along a plane, a first layer of an electrically insulating material arranged on the base plate along the plane, a plurality of heating elements arranged in the first layer along the plane, and a plurality of diodes arranged in respective cavities in the first layer. The plurality of diodes are connected in series to the plurality of heating elements, respectively. Each of the plurality of diodes includes a die of a semiconductor material arranged in a respective one of the cavities. The semiconductor material has a first coefficient of thermal expansion. A first side of the die is arranged on the first layer along the plane. A first terminal of the die is connected to a first electrical contact on the first layer.

公开(公告)号：US20240136214A1

公开(公告)日：2024-04-25

申请号：US18405595

申请日：2024-01-05

Applicant: LAM RESEARCH CORPORATION

Inventor： Siyuan TIAN

IPC: H01L21/683 ,  H01J37/32 ,  H01L23/00

CPC classification number: H01L21/6833 ,  H01J37/32715 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/37147 ,  H01L2224/4005 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48647 ,  H01L2224/49175

Abstract: A substrate support for a plasma chamber includes a base plate arranged along a plane, a first layer of an electrically insulating material arranged on the base plate along the plane, a plurality of heating elements arranged in the first layer along the plane, and a plurality of diodes arranged in respective cavities in the first layer. The plurality of diodes are connected in series to the plurality of heating elements, respectively. Each of the plurality of diodes includes a die of a semiconductor material arranged in a respective one of the cavities. The semiconductor material has a first coefficient of thermal expansion. A first side of the die is arranged on the first layer along the plane. A first terminal of the die is connected to a first electrical contact on the first layer.

公开(公告)号：US20210047732A1

公开(公告)日：2021-02-18

申请号：US17088546

申请日：2020-11-03

Applicant: Lam Research Corporation

Inventor： Siyuan TIAN ,  Donald J. MILLER

IPC: C23C16/46 ,  C23C16/458 ,  G01K7/00

Abstract: An electrical connector includes first, second, third, and fourth electrical conductors. The first, second, third, and fourth electrical conductors each include a first end to be electrically connected to a respective electrically conductive pad formed on a surface of a ceramic layer of a substrate support and a second end to be electrically connected to a respective wire within a through hole in the substrate support. The electrical connector also includes a retainer to hold the first, second, third, and fourth electrical conductors in place.

公开(公告)号：US20190301017A1

公开(公告)日：2019-10-03

申请号：US15936990

申请日：2018-03-27

Applicant: Lam Research Corporation

Inventor： Siyuan TIAN ,  Donald J. MILLER

IPC: C23C16/46 ,  G01K7/00 ,  C23C16/458

Abstract: A substrate support for a plasma system includes a first layer being made of a ceramic and having a first surface and a second surface opposite the first surface. The first layer is configured to support a substrate on the first surface during processing. A thermal heating element is embedded within the ceramic. A temperature sensor that is embedded within the ceramic. Electrically conductive pads are: electrically connected to the temperature sensor via first wires embedded in the ceramic; and formed on the second surface of the first layer. A second layer includes a through hole through the second layer. A connector extends through the through hole and that includes: a retainer; and electrical conductors that are held by the retainer and that include: first ends that are electrically connected to the electrically conductive pads, respectively; and second ends that are electrically connected to a temperature controller by wire.

公开(公告)号：US20220238360A1

公开(公告)日：2022-07-28

申请号：US17614930

申请日：2020-05-29

Applicant: LAM RESEARCH CORPORATION

Inventor： Siyuan TIAN ,  Yuma OHKURA ,  Changyou JING ,  Matthew CLAUSSEN

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  G01K1/08 ,  G01K1/143

Abstract: A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A printed circuit board is configured to be fitted within the inner cavity. A first temperature-sensing integrated circuit mounted at a first end of the printed circuit board. A cap is mounted to a first end of the elongated body adjacent to the first temperature-sensing integrated circuit. A housing is configured to receive a second end of the elongated body, wherein the housing is configured to be mounted to a baseplate of a substrate support.

公开(公告)号：US20200098551A1

公开(公告)日：2020-03-26

申请号：US16136799

申请日：2018-09-20

Applicant: LAM RESEARCH CORPORATION

Inventor： Siyuan TIAN

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: A connection terminal for a heating element of a substrate support in a substrate processing system include a contact plate configured to be electrically connected to a contact pad of the heating element within a ceramic layer of the substrate support. A wire connection portion extends from the contact plate and is configured to receive and retain a wire arranged to provide electrical power to the heating element. At least one of the contact plate and the wire connection portion comprises a first material having a first coefficient of thermal expansion (CTE) that is within 20% of a second CTE of the ceramic layer.

公开(公告)号：US20250087518A1

公开(公告)日：2025-03-13

申请号：US18955355

申请日：2024-11-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Siyuan TIAN

IPC: H01L21/683 ,  H01J37/32 ,  H01L23/00

Abstract: A substrate support for a plasma chamber includes a base plate arranged along a plane, a first layer of an electrically insulating material arranged on the base plate along the plane, a plurality of heating elements arranged in the first layer along the plane, and a plurality of diodes arranged in respective cavities in the first layer. The plurality of diodes are connected in series to the plurality of heating elements, respectively. Each of the plurality of diodes includes a die of a semiconductor material arranged in a respective one of the cavities. The semiconductor material has a first coefficient of thermal expansion. A first side of the die is arranged on the first layer along the plane. A first terminal of the die is connected to a first electrical contact on the first layer.

公开(公告)号：US20240417857A1

公开(公告)日：2024-12-19

申请号：US18819298

申请日：2024-08-29

Applicant: Lam Research Corporation

Inventor： Siyuan TIAN ,  Donald J. Miller

IPC: C23C16/46 ,  C23C16/458 ,  G01K7/00 ,  H01L21/67 ,  H05B3/02

Abstract: An electrical connector includes first, second, third, and fourth electrical conductors. The first, second, third, and fourth electrical conductors each include a first end to be electrically connected to a respective electrically conductive pad formed on a surface of a ceramic layer of a substrate support and a second end to be electrically connected to a respective wire within a through hole in the substrate support. The electrical connector also includes a retainer to hold the first, second, third, and fourth electrical conductors in place.

公开(公告)号：US20230178407A1

公开(公告)日：2023-06-08

申请号：US17920111

申请日：2021-04-06

Applicant: LAM RESEARCH CORPORATION

Inventor： Siyuan TIAN ,  Yuma OHKURA

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  H01J2237/3321 ,  H01J2237/334

Abstract: A substrate support assembly includes a baseplate to support at least one layer to be disposed thereon and a first printed circuit board coupled to the baseplate by a plurality of mounting assemblies that allow the baseplate to move relative to the first printed circuit board.