• Patent Title: ACOUSTIC MATCHING LAYER MATERIAL, ACOUSTIC MATCHING SHEET, COMPOSITION FOR FORMING ACOUSTIC MATCHING SHEET, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASUREMENT APPARATUS, AND MANUFACTURING METHODS OF ACOUSTIC MATCHING LAYER MATERIAL AND ACOUSTIC WAVE PROBE
  • Application No.: US18168219
    Application Date: 2023-02-13
  • Publication No.: US20230190111A1
    Publication Date: 2023-06-22
  • Inventor: Kazuhiro HAMADA
  • Applicant: FUJIFILM Corporation
  • Applicant Address: JP Tokyo
  • Assignee: FUJIFILM Corporation
  • Current Assignee: FUJIFILM Corporation
  • Current Assignee Address: JP Tokyo
  • Priority: JP 20166114 2020.09.30
  • Main IPC: A61B5/00
  • IPC: A61B5/00 C08K3/08 C08L63/00 C08K3/013 G01N29/24
ACOUSTIC MATCHING LAYER MATERIAL, ACOUSTIC MATCHING SHEET, COMPOSITION FOR FORMING ACOUSTIC MATCHING SHEET, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASUREMENT APPARATUS, AND MANUFACTURING METHODS OF ACOUSTIC MATCHING LAYER MATERIAL AND ACOUSTIC WAVE PROBE
Abstract:
Provided are an acoustic matching layer material including a thermosetting resin component and inorganic filler particles, in which in a cross-sectional observation of the acoustic matching layer material, a cross-sectional area of the inorganic filler particles satisfies Expression (1); an acoustic matching sheet; a composition for forming an acoustic matching sheet; an acoustic wave probe; an acoustic wave measurement apparatus; and manufacturing methods of an acoustic matching layer material and an acoustic wave probe:


100×b/c≥25  Expression (1)

wherein b: in a case where a number-average value of cross-sectional areas of the inorganic filler particles is denoted as a, a total cross-sectional area of particles having a cross-sectional area 7 times or more of a in the inorganic filler particles is denoted as b, and c: a total cross-sectional area of the inorganic filler particles is denoted as c.
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