Invention Publication
- Patent Title: COMPOSITION INCLUDING A HIGH MELT TEMPERATURE BUILD MATERIAL
-
Application No.: US18108609Application Date: 2023-02-11
-
Publication No.: US20230191696A1Publication Date: 2023-06-22
- Inventor: Krzysztof Nauka , Kristopher J. Erickson , Howard S. Tom , Lihua Zhao
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y10/00 ; B29C64/291 ; B29C64/336 ; C04B35/636 ; C04B35/634 ; B33Y40/20 ; B33Y70/10 ; B22F10/16 ; B33Y50/02 ; B28B1/00
Abstract:
According to an example, a composition may include a high melt temperature build material in the form of a powder; a first low melt temperature binder in the form of a powder; and a second low melt temperature binder in the form of a powder; and in which the first low melt temperature binder melts at a temperature that is different from the second low melt temperature binder.
Information query
