Invention Publication
- Patent Title: METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVING FLUID GUIDING STRUCTURE
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Application No.: US18172563Application Date: 2023-02-22
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Publication No.: US20230197421A1Publication Date: 2023-06-22
- Inventor: Sheng-Chun YANG , Yi-Ming LIN , Po-Wei LIANG , Chu-Han HSIEH , Chih-Lung CHENG , Po-Chih HUANG
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW HSINCHU
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW HSINCHU
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; C23C16/46 ; C23C16/505 ; C23C16/455 ; H01L21/683

Abstract:
A method includes loading a wafer over a wafer chuck in a process chamber; performing a deposition process on the loaded wafer; supplying a fluid medium to a fluid guiding structure in the wafer chuck from a fluid inlet port on the wafer chuck, the fluid guiding structure comprising a plurality of arc-shaped channels fluidly communicated with each other; guiding the fluid medium from a first one of the arc-shaped channels of the fluid guiding structure to a second one of the arc-shaped channels of the fluid guiding structure. The second one of the arc-shaped channels of the fluid guiding structure is concentric with the first one of the arc-shaped channels of the fluid guiding structure from a top view.
Public/Granted literature
- US12249493B2 Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure Public/Granted day:2025-03-11
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