Invention Application
- Patent Title: Measurement Method, Measurement Device, Measurement System, And Measurement Program
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Application No.: US17853062Application Date: 2022-06-29
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Publication No.: US20230019808A1Publication Date: 2023-01-19
- Inventor: Yoshihiro KOBAYASHI
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2021-109015 20210630
- Main IPC: G01H17/00
- IPC: G01H17/00 ; G01P15/02 ; B61L25/02 ; E01D22/00

Abstract:
A measurement method includes: generating first measurement data based on observation data of an observation point of a structure; generating second measurement data by performing filter processing on the first measurement data; calculating a first deflection amount of the structure; calculating a second deflection amount by performing filter processing on the first deflection amount; approximating the second measurement data with a linear function of the second deflection amount to calculate a first-order coefficient and a zero-order coefficient; calculating a third deflection amount based on the first-order coefficient, the zero-order coefficient, and the second deflection amount; calculating an offset based on the zero-order coefficient, the second deflection amount, and the third deflection amount; and calculating a static response by adding the offset and a product of the first-order coefficient and the first deflection amount.
Public/Granted literature
- US12276542B2 Measurement method, measurement device, measurement system, and measurement program Public/Granted day:2025-04-15
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