发明公开
- 专利标题: MEMS Chip
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申请号: US17739202申请日: 2022-05-09
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公开(公告)号: US20230199408A1公开(公告)日: 2023-06-22
- 发明人: Zhengyu Shi , Linlin Wang , Rui Zhang
- 申请人: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- 申请人地址: CN Shenzhen
- 专利权人: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- 当前专利权人: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- 当前专利权人地址: CN Shenzhen
- 优先权: CN 2123219722.0 2021.12.20
- 主分类号: H04R19/04
- IPC分类号: H04R19/04 ; H04R7/04 ; H04R7/18 ; B81B3/00
摘要:
The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.
公开/授权文献
- US11950053B2 MEMS chip 公开/授权日:2024-04-02
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