Differential resonator and MEMS sensor

    公开(公告)号:US11870417B2

    公开(公告)日:2024-01-09

    申请号:US16986305

    申请日:2020-08-06

    IPC分类号: H03H9/02 H03H9/09

    摘要: The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator through the coupling mechanism, and the first resonator and the second resonator are connected with the substrate and are able to be displaced relative to the substrate. The coupling mechanism includes a coupling arm, a support shaft, a first connecting piece and a second connecting piece. The coupling arm includes a first force arm, a second force arm and a coupling portion. The support shaft has one end connected with the substrate, and one other end connected with the coupling portion. The first force arm is connected with the first resonator through the first connecting piece, and the second force is connected with the second resonator through the second connecting piece.

    MEMS microphone
    3.
    发明授权

    公开(公告)号:US11838725B2

    公开(公告)日:2023-12-05

    申请号:US17566700

    申请日:2021-12-31

    摘要: The present disclosure discloses a MEMS microphone including a substrate with a back cavity, and an electric capacitance system arranged on the substrate. The electric capacitance system includes a back plate and a diaphragm opposite to the back plate. The back plate includes a body part, a fixing portion connected to the substrate, and a connecting portion connecting the body part and the fixing portion. The diaphragm is fixed to the substrate and located at a side of the back plate close to the substrate. The fixing portion includes a first surface away from the substrate, the first surface includes a first arc surface connected with the body part, the first arc surface protrudes toward a direction away from the substrate. Compared with the related art, MEMS microphone disclosed by the present disclosure has a better reliability.

    MEMS Chip
    5.
    发明公开
    MEMS Chip 审中-公开

    公开(公告)号:US20230199409A1

    公开(公告)日:2023-06-22

    申请号:US17739203

    申请日:2022-05-09

    摘要: The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.

    MEMS Chip
    6.
    发明公开
    MEMS Chip 审中-公开

    公开(公告)号:US20230164494A1

    公开(公告)日:2023-05-25

    申请号:US17562011

    申请日:2021-12-27

    摘要: The present disclosure discloses a MEMS chip including a capacitance system and a substrate with a back cavity. The capacitance system includes a back plate and a membrane; the substrate is located on one side of the membrane away from the back plate, including a first surface opposite to the membrane, a second surface opposite to the first surface, and an inner wall connecting the first surface and the second surface and enclosing the back cavity; the inner wall includes a first opening close to the membrane, having a first width along a first direction perpendicular with a vibration direction of the membrane, and a second opening away from the membrane, having a second width smaller than the first width along the first direction. The resonance frequency of the MEMS chip has been effectively improved and the SNR is simultaneously high.

    Piezoelectric MEMS microphone
    7.
    发明授权

    公开(公告)号:US11265657B2

    公开(公告)日:2022-03-01

    申请号:US16987421

    申请日:2020-08-07

    摘要: The invention provides a piezoelectric micro-electromechanical system (MEMS) microphone includes a base with a cavity and a piezoelectric diaphragm arranged on the base. The base has a ring base and a support column. The piezoelectric diaphragm includes a plurality of diaphragm sheets. Each diaphragm sheet has a fixing end connected with the support column and a free end suspended above the cavity. The widths of the diaphragm sheets are gradually increased from the fixing ends to the free ends. According to the piezoelectric MEMS microphone provided by the invention, under sound pressure, the free ends vibrate, wide free ends drive short fixing ends, and the diaphragm sheets close the fixing ends generate greater deformation to generate more charge. Therefore, the sensitivity can be further improved.

    Piezoelectric MEMS microphone
    8.
    发明授权

    公开(公告)号:US11212623B2

    公开(公告)日:2021-12-28

    申请号:US16988738

    申请日:2020-08-10

    摘要: The invention provides a piezoelectric micro-electromechanical systems (MEMS) microphone having a base with a cavity, a piezoelectric diaphragm, and a limit element. The base has a ring base, and a support column. The piezoelectric diaphragm includes diaphragm sheets. Each diaphragm sheet have a fixing end connected with the support column and a free end suspended above the cavity. The limit element includes a limit part arranged apart from the piezoelectric diaphragm to limit the free ends in vibration directions of the diaphragm sheets, and an edge fixing plate connected with the outer edge of the limit part and arranged on the ring base. When the diaphragm sheets greatly deform upwards under impact force, deformation of the diaphragm sheets can be controlled, and the diaphragm sheets are protected to prevent the diaphragm sheets from breaking, thereby improving the stability of the piezoelectric MEMS microphone.

    PIEZOELECTRIC MICROPHONE
    9.
    发明申请

    公开(公告)号:US20200213770A1

    公开(公告)日:2020-07-02

    申请号:US16702597

    申请日:2019-12-04

    发明人: Lian Duan Rui Zhang

    IPC分类号: H04R17/02 H04R31/00

    摘要: The present application provides a piezoelectric microphone, and it includes a substrate having a back cavity and a piezoelectric cantilever diaphragm fixed to the substrate. The piezoelectric cantilever diaphragm includes a plurality of diaphragm flaps, and each of the diaphragm flaps has one end fixed to the substrate and another end suspended above the back cavity. Every two adjacent ones of the diaphragm flaps are spaced apart to form a gap. The piezoelectric microphone further comprises an elastically stretchable member connecting the two adjacent diaphragm flaps, and the elastically stretchable member is provided between at least one set of two adjacent ones of the diaphragm flaps. The piezoelectric microphone of the present disclosure has better performance.

    MEMS microphone
    10.
    发明申请
    MEMS microphone 审中-公开

    公开(公告)号:US20190246215A1

    公开(公告)日:2019-08-08

    申请号:US16234791

    申请日:2018-12-28

    摘要: An MEMS microphone, including a base having a back cavity, and a capacitor system fixedly supported on the base, the capacitor system including a diaphragm and a back-plate spaced from the diaphragm. The diaphragm is provided with a venting portion passing through an edge thereof, and the base includes an inner side surface surrounding the back cavity and at least one venting groove formed by recessing from an inner side surface in a direction away from the back cavity direction. The at least one venting groove is disposed corresponding to the venting portion and is in communication with the venting portion and the back cavity, respectively. The base is provided with a venting groove, so that the back cavity has larger space for venting, and the airflow can easily pass through, thereby reducing the probability of breaking the diaphragm. Thus, the MEMS microphone can have a higher reliability.