发明公开
- 专利标题: MEMS Chip
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申请号: US17739203申请日: 2022-05-09
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公开(公告)号: US20230199409A1公开(公告)日: 2023-06-22
- 发明人: Zhengyu Shi , Linlin Wang , Rui Zhang
- 申请人: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- 申请人地址: CN Shenzhen
- 专利权人: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- 当前专利权人: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
- 当前专利权人地址: CN Shenzhen
- 优先权: CN 2123219721.6 2021.12.20
- 主分类号: H04R19/04
- IPC分类号: H04R19/04 ; H04R7/18 ; H04R7/04 ; B81B3/00
摘要:
The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.
公开/授权文献
- US11968497B2 MEMS chip 公开/授权日:2024-04-23
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