Disclosed is a workplate for Y-axis compensation of an ingot and a Y-axis compensation method of the ingot using the same, which is configured to facilitate Y-axis compensation of the ingot in a state in which the ingot is attached to the workplate at a cutting-plane angle so as to be cut using a wire-cutting apparatus. More particularly, the workplate includes a bottom plate, having an upper surface formed to be curved downwards with respect to a longitudinal direction of the ingot attached to the workplate, and a top plate, coupled to the bottom plate such that a lower surface thereof is movable along the upper surface of the bottom plate and configured to enable the ingot to be coupled to an upper portion thereof at an X-axis cutting-plane angle.