An electronic apparatus includes a first chassis, a second chassis, a hinge device having a movable portion applied with a lubricant and connecting the first chassis and the second chassis relatively rotatably, a spine part made of a thermal conductive material, a first thermal conductive member which is provided on an inner surface of the first chassis and contacts the spine part at a position not to overlap with the movable portion at a second posture, and a second thermal conductive member which is provided on an inner surface of the second chassis and contacts the spine part at a position not to overlap with the movable portion at the second posture.