- 专利标题： NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING
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申请号： US18311304申请日： 2023-05-03
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公开(公告)号： US20230275064A1公开(公告)日： 2023-08-31
- 发明人: Sheng-Chan Li , Cheng-Hsien Chou , Sheng-Chau Chen , Cheng-Yuan Tsai
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 分案原申请号： US17197254 2021.03.10
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/02 ; H01L21/67 ; H01L23/544 ; H01L25/065
摘要：
Various embodiments of the present disclosure are directed towards a processing tool. The processing tool includes a housing structure defining a chamber. A first plate is disposed in the chamber. A first plasma exclusion zone (PEZ) ring is disposed on the first plate. A second plate is disposed in the chamber and underlies the first plate. A second PEZ ring is disposed on the second plate. The second PEZ ring comprises a PEZ ring notch that extends inwardly from a circumferential edge of the second PEZ ring.
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