Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT, AND MULTI-VALUED LOGIC DEVICE INCLUDING THE SAME
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Application No.: US18136464Application Date: 2023-04-19
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Publication No.: US20230335557A1Publication Date: 2023-10-19
- Inventor: Sungil PARK , Jaehyun PARK
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220047993 2022.04.19
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/78 ; H01L29/417 ; H01L29/08 ; H01L29/10

Abstract:
A semiconductor device includes a first common source/drain and a second common source/drain spaced apart from each other in a first direction; a first channel structure between the first common source/drain and the second common source/drain, and a second channel structure between the first common source/drain and the second common source/drain and spaced apart from the first channel structure in a vertical direction; a first gate structure surrounding an upper surface, a lower surface, and side surfaces of the first channel structure; and a second gate structure surrounding an upper surface, a lower surface, and side surfaces of the second channel structure, and spaced apart from the first gate structure, wherein a level of the second channel structure is higher than a level of the first channel structure.
Information query
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