Invention Application
- Patent Title: REVERSE BLOCKING GALLIUM NITRIDE HIGH ELECTRON MOBILITY TRANSISTOR
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Application No.: US17876582Application Date: 2022-07-29
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Publication No.: US20230036698A1Publication Date: 2023-02-02
- Inventor: Ruize SUN , Wanjun CHEN , Chao LIU , Pan LUO , Fangzhou WANG
- Applicant: University of Electronic Science and Technology of China , Institute of Electronic and Information Engineering of UESTC in Guangdong
- Applicant Address: CN Chengdu; CN Dongguan
- Assignee: University of Electronic Science and Technology of China,Institute of Electronic and Information Engineering of UESTC in Guangdong
- Current Assignee: University of Electronic Science and Technology of China,Institute of Electronic and Information Engineering of UESTC in Guangdong
- Current Assignee Address: CN Chengdu; CN Dongguan
- Priority: CN202110868565.1 20210730
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/66 ; H01L29/778 ; H01L29/06

Abstract:
A reverse blocking gallium nitride (GaN) high electron mobility transistor includes, sequentially stacked from bottom to top, a substrate, a nucleation layer, a buffer layer, a barrier layer, a dielectric layer. The buffer layer and the barrier layer form a heterojunction structure. The barrier layer is provided with at least two p-GaN structures. The barrier layer is provided with a source metal at one end and a drain metal at the other end, source metal forms ohmic contact and drain metal forms Schottky contact with AlGaN barrier, respectively. In forward conduction, the two-dimensional electron gas below the spaced p-GaN structure connected to the drain metal is conductive, and a turn-on voltage of the device is low. During reverse blocking, the two-dimensional electron gas at the spaced p-GaN structure is rapidly depleted under reverse bias, to form a depletion region, so that the blocking capability of the device is improved.
Information query
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