发明公开
- 专利标题： HOLISTIC ANALYSIS OF MULTIDIMENSIONAL SENSOR DATA FOR SUBSTRATE PROCESSING EQUIPMENT
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申请号： US17742332申请日： 2022-05-11
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公开(公告)号： US20230367302A1公开(公告)日： 2023-11-16
- 发明人: Chao Liu , Yudong Hao , Shifang Li , Andreas Schulze
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： G05B19/418
- IPC分类号： G05B19/418
摘要：
A method includes receiving, by a processing device, first data. The first data includes data from one or more sensors of a processing chamber and is associated with a processing operation. The first data is resolved in at least two dimensions, one of which is time. The method further includes providing the first data to a model. The method further includes receiving from the model second data. The second data includes an indication of an evolution of a processing parameter during the processing operation. The method further includes causing performance of a corrective action in view of the second data.
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