公开(公告)号：US20220367217A1

公开(公告)日：2022-11-17

申请号：US17321366

申请日：2021-05-14

Applicant: Applied Materials, Inc.

Inventor： Guoheng Zhao ,  Venkatakaushik Voleti ,  Todd J. Egan ,  Kyle R. Tantiwong ,  Andreas Schulze ,  Niranjan Ramchandra Khasgiwale ,  Mehdi Vaez-Iravani

IPC: H01L21/67 ,  C23C16/52 ,  H01L21/66 ,  G01N21/55

Abstract: Methods and systems for monitoring etch or deposition processes using image-based in-situ process monitoring techniques include illuminating a measurement area on a sample disposed in a process chamber. The measurement area is illuminated using an input beam generated remote from the process chamber and transmitted to a first viewing window of the process chamber by a first optical fiber. Portions of the first input beam reflected from the measurement area are transmitted from the first viewing window to an imaging sensor by a second optical fiber. A sequence of images is obtained at the imaging sensor, and a change in reflectance of pixels within each of the images is determined. The etch or deposition process is monitored based on the change in reflectance.

公开(公告)号：US20230367302A1

公开(公告)日：2023-11-16

申请号：US17742332

申请日：2022-05-11

Applicant: Applied Materials, Inc.

Inventor： Chao Liu ,  Yudong Hao ,  Shifang Li ,  Andreas Schulze

IPC: G05B19/418

CPC classification number: G05B19/41885 ,  G05B2219/33034

Abstract: A method includes receiving, by a processing device, first data. The first data includes data from one or more sensors of a processing chamber and is associated with a processing operation. The first data is resolved in at least two dimensions, one of which is time. The method further includes providing the first data to a model. The method further includes receiving from the model second data. The second data includes an indication of an evolution of a processing parameter during the processing operation. The method further includes causing performance of a corrective action in view of the second data.

公开(公告)号：US11908716B2

公开(公告)日：2024-02-20

申请号：US17321366

申请日：2021-05-14

Applicant: Applied Materials, Inc.

Inventor： Guoheng Zhao ,  Venkatakaushik Voleti ,  Todd Egan ,  Kyle R. Tantiwong ,  Andreas Schulze ,  Niranjan Ramchandra Khasgiwale ,  Mehdi Vaez-Iravani

IPC: H01L21/67 ,  C23C16/52 ,  G01N21/55 ,  H01L21/66

CPC classification number: H01L21/67253 ,  C23C16/52 ,  G01N21/55 ,  H01L21/67069 ,  H01L22/12

Abstract: Methods and systems for monitoring etch or deposition processes using image-based in-situ process monitoring techniques include illuminating a measurement area on a sample disposed in a process chamber. The measurement area is illuminated using an input beam generated remote from the process chamber and transmitted to a first viewing window of the process chamber by a first optical fiber. Portions of the first input beam reflected from the measurement area are transmitted from the first viewing window to an imaging sensor by a second optical fiber. A sequence of images is obtained at the imaging sensor, and a change in reflectance of pixels within each of the images is determined. The etch or deposition process is monitored based on the change in reflectance.