- 专利标题： PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE HAVING ELLIPTICAL COLUMNS AND ELLIPSOID JOINT TERMINALS
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申请号： US18356243申请日： 2023-07-21
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公开(公告)号： US20230369152A1公开(公告)日： 2023-11-16
- 发明人: Sheng-Huan Chiu , Chun-Jen Chen , Chen-Shien Chen , Kuo-Chio Liu , Kuo-Hui Chang , Chung-Yi Lin , Hsi-Kuei Cheng , Yi-Jen Lai
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/56 ; H01L23/00
摘要：
A package includes a die, first conductive structures, second conductive structures, and an encapsulant. The die has a rear surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second conductive structures include elliptical columns. At least one of the second conductive structures is closer to the die than the first conductive structures. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures.
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