Invention Publication
- Patent Title: Integrated Hybrid Standard Cell Structure with Gate-All-Around Device
-
Application No.: US18355960Application Date: 2023-07-20
-
Publication No.: US20230369308A1Publication Date: 2023-11-16
- Inventor: Chih-Hao Wang , Shang-Wen Chang , Min Cao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/06 ; H01L29/423 ; H01L29/786 ; H01L29/66 ; H01L21/02 ; H01L21/8238 ; H01L27/092

Abstract:
The disclosed circuit includes a first and a second active region (AR) spaced a spacing S along a direction in a first standard cell (SC) that spans Dl along the direction between a first and a second cell edge (CE). Each of the first and second ARs spans a first width W1 along the direction; a third and a fourth AR spaced S in a second SC that spans a second dimension Ds along the direction between a third and a fourth CE; and gate stacks extend from the fourth CE of the second SC to the first CE of the first SC, wherein Ds
Public/Granted literature
- US12148745B2 Integrated hybrid standard cell structure with gate-all-around device Public/Granted day:2024-11-19
Information query
IPC分类: