发明公开
- 专利标题: SEMICONDUCTOR MODULE
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申请号: US18026006申请日: 2021-09-09
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公开(公告)号: US20230369961A1公开(公告)日: 2023-11-16
- 发明人: Hideo HARA , Naohiro IMAKAKE
- 申请人: Rohm Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: Rohm Co., Ltd.
- 当前专利权人: Rohm Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 优先权: JP 20168742 2020.10.05
- 国际申请: PCT/JP2021/033082 2021.09.09
- 进入国家日期: 2023-03-13
- 主分类号: H02M1/088
- IPC分类号: H02M1/088 ; H02M7/537 ; H02P27/06
摘要:
A semiconductor module includes a first terminal configured to be fed with a first potential, a second terminal, a third terminal configured to be fed with a second potential lower than the first potential, a first switch connected between the first and second terminals, a second switch connected between the second and third terminals, a first driver configured to turn on and off the first switch, and a second driver configured to turn on and off the second switch. The first driver is configured to set, based on a voltage fed to the second terminal, an inhibition period in which the first switch is inhibited from being turned on.
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