- 专利标题: Method For Cooperative Disposal Of Waste Printed Circuit Board Thermal Cracking Slag And Smelting Ash
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申请号: US17625746申请日: 2020-11-11
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公开(公告)号: US20230037130A1公开(公告)日: 2023-02-02
- 发明人: Yufeng Wu , Gongqi Liu , Bin Li
- 申请人: Beijing University of Technology
- 申请人地址: CN Beijing
- 专利权人: Beijing University of Technology
- 当前专利权人: Beijing University of Technology
- 当前专利权人地址: CN Beijing
- 优先权: CN201911359327.7 20191225
- 国际申请: PCT/CN2020/127973 WO 20201111
- 主分类号: C22B1/06
- IPC分类号: C22B1/06 ; C22B7/00 ; C22B11/00 ; C22B19/30 ; C22B15/00
摘要:
The invention discloses a method for co-processing cracking slag and smelting soot of the waste circuit board, belongs to the field of comprehensive recycling of valuable elements from typical soot of waste circuit boards, and particularly relates to a method for co-processing cracking slag and smelting soot of the waste circuit board for debromination and comprehensive recovery of copper and zinc. The method mainly comprises the following steps of: crushing and sorting, mixture roasting, reinforced leaching, replacement and silver precipitation, sulfuration and copper precipitation, and evaporation crystallization. Compared with a traditional recycling technology, the purpose that two kinds of solid waste are treated in a coupling mode through one recycling technology is achieved. Through mixed sulfuric acid roasting, the requirement of bromide synergistic removal of the waste circuit board cracking slag and smelting soot is met, and the purpose of selective conversion of copper and zinc is achieved.
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