发明公开
- 专利标题: HEAT MANAGEMENT SYSTEM
-
申请号: US18027185申请日: 2021-11-01
-
公开(公告)号: US20230373271A1公开(公告)日: 2023-11-23
- 发明人: Jae-Chun YOU , Yochan MIN , Yun Sub CHUNG
- 申请人: Hanon Systems
- 申请人地址: KR Daejeon
- 专利权人: Hanon Systems
- 当前专利权人: Hanon Systems
- 当前专利权人地址: KR Daejeon
- 优先权: KR 20200160712 2020.11.26
- 国际申请: PCT/KR2021/015568 2021.11.01
- 进入国家日期: 2023-03-20
- 主分类号: B60H1/14
- IPC分类号: B60H1/14 ; B60H1/32 ; B60H1/00
摘要:
The present invention relates to a heat management system having performance improved by reducing a distance between components constituting a refrigerant module and minimizing a pressure loss of a refrigerant, the heat management system including: a first heat exchanger heat-exchanging a heat exchange medium flowing thereinto from a compressor; a first expansion valve expanding the heat exchange medium flowing thereinto from the first heat exchanger and transferring the expanded heat exchange medium to a condenser; a second expansion valve expanding the heat exchange medium flowing thereinto from the condenser; a second heat exchanger heat-exchanging the heat exchange medium flowing thereinto from the second expansion valve with a heat-generating component; an accumulator storing the heat exchange medium flowing thereinto from the second heat exchanger; and an internal heat exchanger heat-exchanging the heat exchange medium discharged from the condenser with a heat exchange medium discharged from an evaporator.
公开/授权文献
- US12122218B2 Heat management system 公开/授权日:2024-10-22
信息查询