- 专利标题: PHOTONICS CHIPS WITH RETICLE STITCHING BY SIDE-BY-SIDE TAPERED SECTIONS
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申请号: US17835513申请日: 2022-06-08
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公开(公告)号: US20230400633A1公开(公告)日: 2023-12-14
- 发明人: Yusheng Bian
- 申请人: GlobalFoundries U.S. Inc.
- 申请人地址: US NY Malta
- 专利权人: GlobalFoundries U.S. Inc.
- 当前专利权人: GlobalFoundries U.S. Inc.
- 当前专利权人地址: US NY Malta
- 主分类号: G02B6/122
- IPC分类号: G02B6/122 ; G02B6/13
摘要:
Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a first waveguide core in the first chip region, a second chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary, the first waveguide core includes a first tapered section and the second waveguide core includes a second tapered section adjacent to the first tapered section. The first tapered section has a first longitudinal axis aligned substantially parallel to the boundary, and the second tapered section has a second longitudinal axis aligned substantially parallel to the boundary.
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