- 专利标题: ELECTRICAL CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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申请号: US17570241申请日: 2022-01-06
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公开(公告)号: US20230040128A1公开(公告)日: 2023-02-09
- 发明人: Chih CHEN , Jia-Juen ONG , Kuan-Ju CHEN , Chang-Chih HSIEH
- 申请人: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- 申请人地址: TW Hsinchu City
- 专利权人: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- 当前专利权人: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- 当前专利权人地址: TW Hsinchu City
- 优先权: TW110129246 20210809
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H05K1/14 ; H05K1/18 ; H05K3/30
摘要:
An electrical connecting structure and a method for manufacturing the same are disclosed. The electrical connecting structure comprises: a first substrate; a second substrate; and an interconnect element disposed between the first substrate and the second substrate, wherein the interconnect element has a width, and no joint surface is present in the interconnect element in a range of 50% or more of the width.
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