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公开(公告)号：US20220282389A1
公开(公告)日：2022-09-08
申请号：US17321717
申请日：2021-05-17
发明人： Chih CHEN , Kang-Ping LEE
摘要： A nano-twinned copper layer with a doped metal element is disclosed, wherein the nano-twinned copper is doped with at least one metal element selected from the group consisting of Ag, Ni, Al, Au, Pt, Mg, Ti, Zn, Pd, Mn and Cd in a region from a surface of the nano-twinned copper layer to a depth being 0.3 μm, and a content of the metal element in the region is ranged from 0.5 at % to 20 at %. In addition, at least 50% in volume of the nano-twinned copper layer includes plural twinned grains. Furthermore, a substrate including the aforesaid nano-twinned copper layer and a method for preparing the aforesaid nano-twinned copper layer are also disclosed.
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公开(公告)号：US20240229275A1
公开(公告)日：2024-07-11
申请号：US18456923
申请日：2023-08-28
发明人： Chih CHEN , Guan-You SHEN
CPC分类号： C25D1/04 , C25D3/38 , C25D7/0614
摘要： A nano-twinned copper foil is provided, which comprises: plural twinned grains, wherein at least part of the plural twinned grains are formed by stacking plural nano-twins along a [111] crystal axis. The nano-twinned copper foil has a first surface and a second surface opposite to the first surface, and 80% or more of areas of the first surface and the second surface respectively exposes (111) planes of the nano-twins. In addition, the present invention further provides a method for manufacturing the aforesaid nano-twinned copper foil, an electronic element comprising the same, and a method for manufacturing the electronic element.
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公开(公告)号：US20230220517A1
公开(公告)日：2023-07-13
申请号：US17708371
申请日：2022-03-30
发明人： Chih CHEN , Kang-Ping LEE , Yu-I CHANG , Yun-Hsuan CHEN
摘要： A nano-twinned Cu—Ni alloy layer is provided, wherein more than 50% in volume of the nano-twinned Cu—Ni alloy layer comprises plural twinned grains, the plural twinned grains comprise plural columnar twinned grains, and a Ni content in the nano-twinned Cu—Ni alloy layer is in a range from 0.05 at % to 20 at %. In addition, a method for manufacturing the aforesaid nano-twinned Cu—Ni alloy layer is also provided.
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公开(公告)号：US20220392049A1
公开(公告)日：2022-12-08
申请号：US17472955
申请日：2021-09-13
发明人： King-Ning TU , Chih CHEN , Yu-Chieh LO , Nan-Yow CHEN , Kai-Cheng SHIE
摘要： An auxiliary prediction system is provided to predict reliability of an object after a specific operation is applied to the target object. The auxiliary prediction system includes an image correction module and an analysis module. The image correction module performs an image correction procedure to convert an original image of the target object into a first correction image. The analysis module performs a feature analysis on the first correction image through an artificial intelligence model that has been trained, so as to predict whether the target object has a defect or not after the specific operation.
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公开(公告)号：US20240234351A9
公开(公告)日：2024-07-11
申请号：US18348365
申请日：2023-07-07
发明人： Chih CHEN , Shih-Chi YANG
IPC分类号： H01L23/00 , H01L25/065
CPC分类号： H01L24/08 , H01L24/03 , H01L24/05 , H01L24/80 , H01L25/0657 , H01L2224/02165 , H01L2224/03462 , H01L2224/05647 , H01L2224/0801 , H01L2224/08121 , H01L2224/08148 , H01L2224/80895 , H01L2225/06524 , H01L2924/2064
摘要： An electrical connection includes a first driving substrate, a first adhesive layer, a first bonding pad a first bonding pad and a second bonding pad. The first driving substrate includes a first substrate and a first dielectric layer on the first substrate. The first adhesive layer is at a sidewall of the first dielectric layer of the first driving substrate. The first bonding pad is on the first substrate of the first driving substrate and in contact with the first adhesive layer, and the first bonding pad includes a plurality of grains, the grains are connected with each other, the grains include [111]-oriented copper grains, and a maximum width of the first bonding pad is equal to or less than 8 microns. The second bonding pad is on the first bonding pad.
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公开(公告)号：US20240021549A1
公开(公告)日：2024-01-18
申请号：US17866209
申请日：2022-07-15
发明人： Chih CHEN , Hsiang-Hou TSENG
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065 , H01L21/48 , H01L23/498
CPC分类号： H01L24/05 , H01L24/03 , H01L24/08 , H01L24/80 , H01L25/50 , H01L25/0657 , H01L25/0652 , H01L25/0655 , H01L21/486 , H01L23/49827 , H01L2224/03462 , H01L2224/03464 , H01L2224/05639 , H01L2224/80203 , H01L2224/80092 , H01L2224/05147 , H01L2224/05083 , H01L2224/05573 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2924/04941 , H01L2924/04953 , H01L2224/05026 , H01L2224/94 , H01L24/94 , H01L2224/08145 , H01L2224/08225 , H01L2224/80439 , H01L2224/97 , H01L21/561
摘要： A method includes forming a first connector and a second connector over a first wafer and a second wafer, respectively, in which each of the first and second connectors are formed by forming an opening in a dielectric layer; depositing a first metal layer in the opening, in which the first metal layer has a nano-twinned structure with (111) orientation; and depositing a second metal layer over the first metal layer, the second metal layer and the first metal layer being made of different materials, in which the second metal layer has a nano-twinned structure with (111) orientation; attaching the first wafer to the second wafer, such that that the second metal layer of the first connector on the first wafer is in contact with the second metal layer of the second connector on the second wafer; and performing a thermo-compression process to bond the first and second wafers.
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公开(公告)号：US20230040128A1
公开(公告)日：2023-02-09
申请号：US17570241
申请日：2022-01-06
发明人： Chih CHEN , Jia-Juen ONG , Kuan-Ju CHEN , Chang-Chih HSIEH
摘要： An electrical connecting structure and a method for manufacturing the same are disclosed. The electrical connecting structure comprises: a first substrate; a second substrate; and an interconnect element disposed between the first substrate and the second substrate, wherein the interconnect element has a width, and no joint surface is present in the interconnect element in a range of 50% or more of the width.
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公开(公告)号：US20230014483A1
公开(公告)日：2023-01-19
申请号：US17469352
申请日：2021-09-08
发明人： Chih CHEN , Fu-Chian CHEN , Wei-You HSU , Wen-Wei WU , Jeng-Kuei CHANG
IPC分类号： H01M4/66 , H01M4/587 , H01M4/38 , H01M10/0525
摘要： An electrode for a lithium-ion battery is disclosed, which comprises: a collector comprising a nano-twinned copper foil; and a negative electrode material disposed on the collector, wherein the negative electrode material comprises at least one selected from the group consisting of: silicon, silicon nitride, graphite, graphene, carbon nanotubes, carbon nano-fibers and carbon nano-particles. In addition, a lithium-ion battery comprising the aforesaid electrode is also provided.
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公开(公告)号：US20220259754A1
公开(公告)日：2022-08-18
申请号：US17574151
申请日：2022-01-12
发明人： Chih CHEN , Wei-You HSU
摘要： A twinned copper layer is disclosed, wherein 35% or more in volume of the twinned copper layer comprises plural twinned grains, 30% or more of the twinned grains are flake twinned grains, and a ratio of a length to a thickness of at least a part of the flake twinned grains is greater than or equal to 2. In addition, a substrate having the aforesaid twinned copper layer and a method for preparing the aforesaid twinned copper layer are also disclosed.
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公开(公告)号：US20240136313A1
公开(公告)日：2024-04-25
申请号：US18348365
申请日：2023-07-06
发明人： Chih CHEN , Shih-Chi YANG
IPC分类号： H01L23/00 , H01L25/065
CPC分类号： H01L24/08 , H01L24/03 , H01L24/05 , H01L24/80 , H01L25/0657 , H01L2224/02165 , H01L2224/03462 , H01L2224/05647 , H01L2224/0801 , H01L2224/08121 , H01L2224/08148 , H01L2224/80895 , H01L2225/06524 , H01L2924/2064
摘要： An electrical connection includes a first driving substrate, a first adhesive layer, a first bonding pad a first bonding pad and a second bonding pad. The first driving substrate includes a first substrate and a first dielectric layer on the first substrate. The first adhesive layer is at a sidewall of the first dielectric layer of the first driving substrate. The first bonding pad is on the first substrate of the first driving substrate and in contact with the first adhesive layer, and the first bonding pad includes a plurality of grains, the grains are connected with each other, the grains include [111]-oriented copper grains, and a maximum width of the first bonding pad is equal to or less than 8 microns. The second bonding pad is on the first bonding pad.
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