发明公开
- 专利标题: CERAMIC ELECTRONIC COMPONENT
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申请号: US18237555申请日: 2023-08-24
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公开(公告)号: US20230411076A1公开(公告)日: 2023-12-21
- 发明人: Hee Sun CHUN , Hui Sun PARK , Tae Hyung KIM , Jeong Wook SEO , Hyo Ju LEE , Hyeg Soon AN , Jin Woo KIM , Seok Hyun YOON
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20210141261 2021.10.21
- 主分类号: H01G4/12
- IPC分类号: H01G4/12 ; H01G4/008 ; H01G4/012 ; H01G4/30
摘要:
A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.
公开/授权文献
- US12062494B2 Ceramic electronic component 公开/授权日:2024-08-13
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