- 专利标题: Ceramic electronic component
-
申请号: US18237555申请日: 2023-08-24
-
公开(公告)号: US12062494B2公开(公告)日: 2024-08-13
- 发明人: Hee Sun Chun , Hui Sun Park , Tae Hyung Kim , Jeong Wook Seo , Hyo Ju Lee , Hyeg Soon An , Jin Woo Kim , Seok Hyun Yoon
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: MORGAN, LEWIS & BOCKIUS LLP
- 优先权: KR 20210141261 2021.10.21
- 主分类号: H01G4/12
- IPC分类号: H01G4/12 ; H01G4/008 ; H01G4/012 ; H01G4/30
摘要:
A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.
公开/授权文献
- US20230411076A1 CERAMIC ELECTRONIC COMPONENT 公开/授权日:2023-12-21
信息查询