- 专利标题: POLYAMIC ACID COMPOSITION, AND POLYIMIDE COMPRISING SAME
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申请号: US18037839申请日: 2020-11-27
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公开(公告)号: US20230416464A1公开(公告)日: 2023-12-28
- 发明人: In Hwan HWANG , Ik Sang LEE
- 申请人: PI ADVANCED MATERIALS CO., LTD.
- 申请人地址: KR Chungcheongbuk-do
- 专利权人: PI ADVANCED MATERIALS CO., LTD.
- 当前专利权人: PI ADVANCED MATERIALS CO., LTD.
- 当前专利权人地址: KR Chungcheongbuk-do
- 优先权: KR 20200155541 2020.11.19
- 国际申请: PCT/KR2020/017153 2020.11.27
- 进入国家日期: 2023-05-19
- 主分类号: C08G73/10
- IPC分类号: C08G73/10 ; C08K3/40 ; C08L79/08 ; C08J5/18
摘要:
The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
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